10M04DAU324C8G

Series	MAX® 10
Package	Tray
Product Status	Active
Number of LABs/CLBs	250
Number of Logic Elements/Cells	4000
Total RAM Bits	193536
Number of I/O	246
Voltage - Supply	1.15V ~ 1.25V
Mounting Type	Surface Mount
Operating Temperature	0°C ~ 85°C (TJ)
Package / Case	324-LFBGA
Supplier Device Package	324-UBGA (15x15)

 

Description

Technology

55 nm TSMC Embedded Flash (Flash + SRAM) process technology

 

Packaging

• Low cost, small form factor packages—support multiple packaging

technologies and pin pitches

• Multiple device densities with compatible package footprints for seamless

migration between different device densities

• RoHS6-compliant

 

Core architecture

• 4-input look-up table (LUT) and single register logic element (LE)

• LEs arranged in logic array block (LAB)

• Embedded RAM and user flash memory

• Clocks and PLLs

• Embedded multiplier blocks

• General purpose I/Os

 

Internal memory blocks

• M9K—9 kilobits (Kb) memory blocks

• Cascadable blocks to create RAM, dual port, and FIFO functions

 

User flash memory (UFM)

• User accessible non-volatile storage

• High speed operating frequency

• Large memory size

• High data retention

• Multiple interface option

 

Embedded multiplier blocks

• One 18 × 18 or two 9 × 9 multiplier modes

• Cascadable blocks enabling creation of filters, arithmetic functions, and image

processing pipelines

 

ADC

• 12-bit successive approximation register (SAR) type

• Up to 17 analog inputs

• Cumulative speed up to 1 million samples per second ( MSPS)

• Integrated temperature sensing capability

Clock networks

• Global clocks support

• High speed frequency in clock network

Internal oscillator

Built-in internal ring oscillator

 

PLLs

• Analog-based

• Low jitter

• High precision clock synthesis

• Clock delay compensation

• Zero delay buffering

• Multiple output taps

General-purpose I/Os (GPIOs)

• Multiple I/O standards support

• On-chip termination (OCT)

• Up to 720 megabits per second (Mbps) LVDS receiver and transmitter

External memory interface (EMIF) (1)

Supports up to 600 Mbps external memory interfaces:

• DDR3, DDR3L, DDR2, LPDDR2 (on 10M16, 10M25, 10M40, and 10M50.)

• SRAM (Hardware support only)

 

PAYMENT TERMS

 

● We accept PayPal, Trade Assurance, MonryGram, Western Union and Bank T/T

● FOB price, not including shipping cost and trading charges.
● The buyers should be responsible for the trading charges.

 

SHIPPING TERMS

● We will pack and send your goods within 1-3 working days after we confirmed your payment.
● We will inform you the lead time if we have to purchase from manufactory.

● We usually ship by DHL, EMS , UPS, TNT, FedEx, or Aramex . It usually takes 3-5 days to arrive.China Post smallpacket and sea shipping are aslo optional，But the time is slow, suitable for samples and large quantities of goods.
● We are not responsible for any accidents, delays or other situations related with shipping company. But we will keep focus on the package tracking.
● Tracking number will be shared with you when we got it from the logistics company.

 

http://www.xiannengic.com/